硅晶片金刚线多线切割机

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本文阐述了硅晶片金刚线多线切割原理，并对自主研发的硅晶片多线切割机及其工艺作了介绍。

The paper described the principle of silicon wafer diamond multi-line cutting. At the same time, we will introduce the silicon wafer diamond multi-line cutting machine by ourcompany. In addition, the process was also described.

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硅晶片金刚线多线切割机。