Mn3（Cu0.6Si0．15Ge0．25）N／Ag复合材料的负热膨胀与物理性能

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Mn3（Cu0.6Si0.15Ge0.25）N/Ag composites were prepared by mechanical ball milling and sol- id state sintering. The thermal expansion coefficients, electrical conductivities and thermal conductivi- ties of Mn3（Cu0.6Si0.15Ge0.25）N/Ag composites were studied in the temperature range from 77 K to 300 K. All samples with Ag amount of 1, 5, 10 and 20 wt% show negative thermal expansion （NTE） within an effective temperature range from 205 K to 275 K. It is interesting to find that the effective temperature range of NTE moves toward room temperature and becomes narrower with the increase of Ag content. Furthermore, Mn3（Cu0.6Si0.15Ge0.25）N/Ag composite exhibits a higher electri- cal conductivity of 1 106（ Ohm ? m） - 1 and thermal conductivity of 10.5 W/（inK） than that of Mn3（Cu0.6Si0.15Ge0.25）N.采用机械球磨加固相烧结法合成Mn3（Cu0.6Si0．15Ge0．25）N／Ag复合材料。在77K-300K温度范围内，分别研究了Mn3（Cu0.6Si0．15Ge0．25）N／Ag复合材料的热膨胀性能，电导性能和热导性能。当含Ag量分别为1，5，10和20wt％时，所有样品在有效的温度区间205K-275K表现出负热膨胀。随着Ag含量的增加，有效温度区间向室温方向移动。另外，和Mn3（Cu0.6Si0．15Ge0．25）N材料相比，Mn3（Cu0.6Si0．15Ge0．25）N／Ag复合材料具有更高的电导率1×10-6（Ohm?m）-1和热导率10．5W／（mK）。