基于螺旋理论的转动解耦调平机构型综合

本资料包含pdf文件1个，下载需要1积分

A leveling mechanism for adjusting the parallelism between the chip and substrate is a key part of flip chip bonder and it takes significant effect on the yield of product developed by flip chip technology.The basic condition to develop a two-degree-of-freedom rotational decoupled mechanism was proposed based on screw theory,and type synthesis of this kind of parallel mechanism was accomplished.Each of these mechanisms had three legs,the first of which was only made up of two passive revolute joints and the other two of which each owned an active joint to drive platform to rotate about one of the axes of revolute joints in the first leg respectively.Furthermore,mobility analysis,the selection of inputs and kinematics simulation using ADAMS were dealt with in sequence for one type of mechanism which was only constructed by revolute and prismatic joints.Results show that this mechanism is applicable to flip chip bonder,precision worktable and other circumstance.芯片与基板之间的平行度调节机构对倒装键合设备的成品率起着决定性作用。为研制该调平机构,基于螺旋理论分析了二自由度转动解耦机构的实现条件,综合出了一类含有3支链的转动解耦的并联机构。该类机构的支链1不含驱动副,由2个转动副组成;支链2和支链3各有1个驱动副,分别驱动动平台绕支链1中的一根转动副轴线旋转。针对其中一种只含转动副和移动副的构型进行了自由度验算,选择了合适的输入运动副,并利用ADAMS完成了该机构的运动学仿真。研究结果表明,该转动解耦的调平机构可应用于倒装键合设备、精密运动平台等多种场合。