硬脆材料超声振动磨削的试验研究

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In order to investigate the low efficiency problem in grinding hard-brittle materials,an ultrasonic vibration grinding method of silicon wafer was proposed.In a comparative experiment on ultrasonic vibration grinding and traditional grinding,the impact of varying grinding parameters on grinding force and surface roughness was tested.Also,the mechanism of removing plastic and brittle properties of hard-brittle materials was analyzed based on the testing results.The study demonstrates that the grinding efficiency for hard-brittle materials can be improved using ultrasonic vibration grinding method although the roughness is slightly high.It is a practical technology for processing hard-brittle materials.针对硬脆材料磨削效率低的难题,研究了硅片的超声振动磨削方法。进行了超声振动磨削与普通磨削的对比试验,研究了磨削参数变化对磨削力及表面粗糙度的影响,根据试验结果,分析了硬脆材料的脆性与塑性去除机理。研究证明：超声振动磨削硬脆材料虽然使粗糙度略有变大,但能够明显提高加工效率,降低加工成本。综合考虑精度与效率指标,超声振动磨削是一种实用的硬脆材料加工技术。