铜双晶水平与垂直晶界压缩形貌观察与分析

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The microscopic morphologies of uniaxially compressed copper bicrystals （CB） with horizon- tal and vertical grain boundaries （GB） were observed. Experiment results have shown that, under the same comppressive loading condition and comparing the case of CB sample with horizontal GB, a higher stress exists beside the GB for the CB sample with vertical GB, for which there are much more micro-voids and cracks, whose locations are much concentrated to or beside the slip lines.对含水平和垂直晶界的铜双晶进行了等应压缩，并对变形后的显微形貌进行了观察．结果表明：在等应变压缩条件下，相比于水平晶界双晶体，垂直晶界双晶体中晶界附近的应力更高，孔洞和裂纹数量多于水平晶界的，孔洞和裂纹分布位置更集中于滑移线上或临近滑移线某一侧．